Funds are available to support about 150 domestic and foreign students to attend the Civil, Mechanical and Manufacturing Innovation Grantees Conference, to be held in June 22-25, 2009, in Honolulu, Hawaii. The theme of this conference is Research and Education in a Flat World, and the inclusion of students from around the world will complement this theme.

Student support will cover conference registration fees (including most meals during the conference) and hotel accommodations (for four nights from June 21 to 24, double occupancy).  In addition, domestic students (those who are studying at US universities) may apply for additional travel subsidies of $400 per person.

Applications for such student support will be reviewed by an ad hoc committee. Selections will be made based on factors that include diversity, research topic relevance, and poster presentation.